Electron emission device, electron source, and image display having dipole layer

ABSTRACT

An electron emission device is provided which has sufficient on/off characteristics and is capable of efficiently emitting electrons with a low voltage. An electron emission device includes a substrate, a cathode electrode, a gate electrode, which are arranged on the substrate, an insulation layer covering the surface of the cathode electrode, and a dipole layer formed by terminating the surface of the insulation layer with hydrogen.

BACKGROUND OF THE INVENTION

2. Field of the Invention

The present invention relates to a field emission type electron emissiondevice using an electron emission film, an electron source having anumber of the electron emission devices, and an image displayconstructed using the electron source.

2. Description of the Related Art

The electron emission device includes a field emission type (referred toas an FE type below) and a surface conduction type electron emissiondevice.

The FE type electron emission device is a device for extractingelectrons into a vacuum from a cathode electrode (or the electronemission film) by applying a voltage (electric field) between thecathode electrode (and the electron emission film disposed thereon) anda gate electrode. Therefore, the operating electric field is largelyaffected by the work function and the shape of the cathode electrode(the electron emission film), and in general, the cathode electrode (theelectron emission film) with a small work function may be necessary tobe selected.

Japanese Patent Laid-Open No. 9-199001 discloses an electron emissiondevice having a metal as the cathode electrode and a semiconductor(diamond, AlN, BN, etc.) bonded to the metal. In that Japanese Patent, amethod is disclosed in which the semiconductor film surface of diamondwith a thickness of about 10 nm or less is terminated with hydrogen soas to make negative on electron affinity of the semiconductor film. FIG.14 is a band diagram showing the electron emission principle of theelectron emission device disclosed in Japanese Patent Laid-Open No.9-199001. In the drawing, reference numeral 1 denotes the cathodeelectrode, numeral 141 the semiconductor film, numeral 3 an extractionelectrode, numeral 4 a vacuum barrier, and numeral 6 an electron.

Diamond having a surface terminated with hydrogen is typical as amaterial having a negative electron affinity. An electron emissiondevice using a diamond surface as an electron emission surface isdisclosed in U.S. Pat. No. 5,283,501, U.S. Pat. No. 5,180,951, Zhinov.J. Liu et al, “Environmental Effect On the electron emission fromdiamond surfaces”, and J. Vac. Sci. Technol, B16(3), May/June, 1998, PP.1188-1193.

SUMMARY OF THE INVENTION

In the conventional electron emission device using diamond mentionedabove, electron emission at a low threshold electric field and a largecurrent emission are enabled. On the other hand, when a semiconductorhaving a negative electron affinity or an extremely small positiveelectron affinity is used, if the semiconductor is once injected with anelectron, the electron is almost certainly emitted. Therefore, thecharacteristics readily emitting electrons may disable the control(on/off switching, in particular) of the electron emission from eachelectron emission device applied to an electron source or a displaydevice.

In general, in an electron source having FE type electron emissiondevices arranged in a matrix form (matrix pattern) and a display (FED)using the electron source, each electron emission device is connected toone of a plurality of pieces of wiring in the X-direction (scanningwiring to be applied by a scanning signal) and to one of a plurality ofpieces of wiring in the Y-direction (signal wiring to be applied by amodulation signal). In the case of so-called “line-by-line driving”, adesired one piece of the wiring in the X-direction is selected from aplurality of pieces of wiring in the X-direction so as to apply ascanning signal thereto while a modulation signal is applied to thewiring in the Y-direction connected to a desired electron emissiondevice connected to the wiring in the X-direction selected inconjunction with the scanning signal. By performing this operationsequentially on another piece of the wiring in the X-direction, the“line-by-line driving” is carried out. The “line-by-line driving” is notlimited to driving one line at a time, and a plurality of lines (aplurality of wirings in the X-direction) may be simultaneously driven.In other words, the scanning signal may be applied, at the same time, totwo or more wirings in the X-direction.

In the “line-by-line driving”, an electron emission device applied by avoltage other than 0 V (typically, half of the drive voltage applied tothe selected electron emission device) may exist in non-selectedelectron emission devices (electron emission devices connected to thenon-selected scanning wiring). A state in which a voltage lower than thedrive voltage during selection (and other than 0 V) is applied to anon-selected electron emission device is called as a “half-selected”state. The voltage applied to the electron emission device in the“half-selected” state is called a “half-selected voltage”. Also, currentemitted from the electron emission device in the “half-selected” stateand/or the current flowing through the electron emission device in the“half-selected” state are called as a “half-selected current”. Thecurrent emitted from the selected electron emission device and/or thecurrent flowing through the electron emission device in the selectedstate are each called a “selected current”, and a ratio of the“half-selected current” and the “selected current” is referred to as a“half-selected current ratio”.

When the “line-by-line driving” method is applied to an electron sourceor a display including a plurality of electron emission devices using asemiconductor having a negative electron affinity or an extremely smallpositive electron affinity arranged in the matrix form, theabove-mentioned “half-selected current” is liable to arise. This candegrade displayed images or the contrast of images.

Next, the “half-selected current” regarding the contrast will bedescribed. A field emission current J conforming to the Fowler-Nordheimmodel is expressed as follows: $\begin{matrix}{{\left\lbrack {{Numerical}\quad{Formula}\quad 1} \right\rbrack\quad J} = \quad{{\frac{A\quad E^{2}}{\phi\quad t}{\exp\left( {{- B}\frac{\phi^{1.5}}{E}v} \right)}} \approx {\frac{{A\left( {V\quad\beta} \right)}^{2}}{\phi\quad t}{\exp\left( {{- B}\frac{\phi^{1.5}}{\quad{V\quad\beta}}} \right)}}}} & (1)\end{matrix}$where A, B: constant, φ: height of barrier (corresponding to electronaffinity), V: applied voltage, and β: electric field enhancement factor.Therefore, the half-selected current J_(half) is: $\begin{matrix}{{\left\lbrack {{Numerical}\quad{Formula}{\quad\quad}2} \right\rbrack\quad J_{half}} \approx {\frac{{A\left( {V\quad\beta} \right)}^{2}}{4\phi\quad t}{\exp\left( {{- B}\frac{2\quad\phi^{1.5}}{V\quad\beta}} \right)}}} & (2)\end{matrix}$

Therefore, the half-selected current ratio is expressed as:$\begin{matrix}{{{\left\lbrack {{Numerical}\quad{Formula}{\quad\quad}3} \right\rbrack\quad\frac{J_{half}}{J}} \approx \frac{\frac{{A\left( {V\quad\beta} \right)}^{2}}{4\phi\quad t}{\exp\left( {{- B}\frac{2\quad\phi^{1.5}}{V\quad\beta}} \right)}}{\frac{{A\left( {V\quad\beta} \right)}^{2}}{\phi\quad t}{\exp\left( {{- B}\frac{\phi^{1.5}}{V\quad\beta}} \right)}}} = {\frac{1}{4}{\exp\left( {{- B}\frac{\phi^{1.5}}{V\quad\beta}} \right)}}} & (3)\end{matrix}$

The above-mentioned “half-selected current ratio” corresponds to thecontrast between a display section (light emitting section) forperforming the display and a non-display section (non-light-emittingsection). For example, it is important for the display to have acontrast ratio of 1/1000. In achieving the contrast ratio=1/1000, if theentire electrons field-emitted from the cathode electrode (or theelectron emission film) are assumed to contribute to the light emissionof a light-emitting member, the “half-selected current ratio” is givenby: $\begin{matrix}{{\left\lbrack {{Numerical}\quad{formula}\quad 4} \right\rbrack\quad\frac{1}{1000}} > {\frac{1}{4}{\exp\left( {{- B}\frac{\phi}{V\quad\beta}} \right)}}} & (4)\end{matrix}$

The equation (4) can be written as: $\begin{matrix}{{B\frac{\phi}{V\quad\beta}} > 5.5} & (5)\end{matrix}$

As is apparent from the equation (5), in order to have a contrastratio=1/1000, values of V and β are preferably smaller and φ is larger.Also, when a material having a negative electron affinity is used, theequation (5) cannot be satisfied so as not to achieve a sufficient ordesired contrast in an image display using such an electron emissiondevice. FIG. 15 shows the relationship between Vβ in each φ andφ^(1.5)/Vβ.

The case where the entire electrons emitted from the cathode electrode(or the electron emission film) become emission currents has beendescribed. However, in the “half-selected” state, even when some (or theentire) of the emitted electrons flow to the gate electrode, not only isthe electric power consumption of the device itself increased, but alsothe so-called “line-by-line driving” cannot be substantially carriedout.

Problems produced when the electron emission device is driven in amatrix arrangement have been described here. There also can be otherproblems in the electron emission device using a semiconductor having anegative electron affinity or an extremely small positive electronaffinity. That is, since the electron emission device mentioned abovehas an extremely small threshold electric field, in the case where theanode electrode and the electron emission device are arranged so as tooppose each other, as in an image display, the electron emission deviceis always exposed to a high electric field due to the anode electrode.Therefore, if the anode electrode and the electron emission device aresimply arranged so as to oppose each other, even when the applyingvoltage to the electron emission device is 0 volt (non-selected state),electrons may be easily emitted by the electric field due to the anodeelectrode. As a result, in the same way as the problems in theabove-mentioned “line-by-line driving”, a problem of the on/off contrastarises so that the function of the image display may be disabled.

It is an object of the present invention to provide an electron emissiondevice having desired and sufficient on/off characteristics and beingcapable of efficiently emitting electrons with a low voltage, anelectron source using the electron emission device, and furthermore animage display with a high contrast, each of which overcomes the problemsdescribed above.

An electron-emitting device according to the present invention includes:

(A) a cathode electrode;

(B) an insulation layer covering at least part of a surface of thecathode electrode and having a dipole layer formed on its surface (orhaving a surface including a dipole layer); and

(C) an extraction electrode,

wherein an electron emission to vacuum, by quantum-mechanical tunnelingthrough the insulation layer and a vacuum barrier by applying a voltagebetween the cathode electrode and the extraction electrode, takes placein a condition where the vacuum barrier in contact with the dipole layeris higher than a conduction band on the surface of the insulation layer.

An electron source of the invention includes a plurality of electronemission devices according to the present invention, and an imagedisplay includes the electron source according to the present inventionand a luminous body (light-emitting member).

An electron emission device according to the present invention maypreferably further include at least one of the following features:

a thickness of the insulation layer is 10 nm or less;

the dipole layer is formed by terminating the surface of the insulationlayer with hydrogen;

the surface of the insulation layer has a positive electron affinityduring the electron emission;

the insulation layer contains carbon as a principal ingredient, andpreferably the carbon includes an sp³ hybrid orbital structure carbon asa principal ingredient;

a Root-Mean-Square (RMS) surface roughness of the insulation layer issmaller than one tenth of a film thickness of the insulation layer;

the RMS surface roughness of the cathode electrode is smaller than onetenth of the film thickness of the insulation layer;

the RMS surface roughness of the cathode electrode is 1 nm or less;

the extraction electrode and the cathode electrode are separated by aspatial interval, on a substrate upon which they are arranged;

more preferably, a surface of the substrate is exposed through a gapformed between the cathode electrode and the extraction electrode, andalso is provided with a recess;

at least part of the insulation layer is arranged on a surface of thecathode electrode opposing the extraction electrode;

an end of the insulation layer is not in contact with the surface of thesubstrate or the end of the insulation layer is spaced from and does notcover at least part of a surface of the cathode electrode opposing theextraction electrode; and

the extraction electrode is disposed above the cathode electrode and hasan opening for passing an electron therethrough, and the insulationlayer also has an opening (exposing the cathode electrode) disposed at aposition corresponding to the opening of the extraction electrode.

As described above, an electron emission device according to the presentinvention preferably is a field emission type electron emission devicecapable of efficiently emitting electrons with a low voltage and goodon/off characteristics. A display with a high contrast can be achievedusing this device.

Further objects, features and advantages of the present invention willbecome apparent from the following description of the preferredembodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1, consisting of FIGS. 1A and 1B, is a band diagram forillustrating an electron emitting principle of an electron emissiondevice according to the present invention.

FIG. 2, consisting of FIGS. 2A and 2B, is a partially enlarged schematicview of the electron emission device according to the present invention.

FIG. 3 is a sectional schematic view of an example of the electronemission device according to the present invention.

FIG. 4 is a sectional schematic view of an example of the electronemission device according to the present invention.

FIG. 5 is a sectional schematic view of an example of the electronemission device according to the present invention.

FIG. 6 is a sectional schematic view of an example of the electronemission device according to the present invention.

FIG. 7, consisting of FIGS. 7A and 7B, is a sectional schematic view ofan example representing a manufacturing method of an electron emissiondevice according to the present invention.

FIG. 8 is a schematic structural drawing showing an example of anelectron source according to the present invention.

FIG. 9 is a schematic structural drawing showing an example of an imagedisplay according to the present invention.

FIG. 10, consisting of FIGS. 10A to 10C, is a sectional schematic viewof another example representing a manufacturing method of an electronemission device according to the present invention.

FIG. 11, consisting of FIGS. 11A and 11B, is a drawing showing an SESspectrum of an insulation layer in an Example 1 of the presentinvention.

FIG. 12 is a drawing showing current/voltage characteristics whenelectrons are emitted from the insulation layer in Example 1 of thepresent invention.

FIG. 13 is a drawing showing current/voltage characteristics of anelectron emission device in Example 3 of the present invention.

FIG. 14 is a band diagram for illustrating an electron emittingprinciple of a conventional electron emission device.

FIG. 15 is a drawing showing the range capable of obtaining a contrastratio of 1/1000 in the electron emission device according to the presentinvention.

FIG. 16, consisting of FIGS. 16(a) to 16(e), is a sectional schematicview of another example of a manufacturing method of an electronemission device according to the present invention.

FIG. 17, consisting of FIGS. 17(a) to 17(h), is a sectional schematicview of another example of the manufacturing method of the electronemission device according to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

An object of the present invention is to improve the controllability ofan electron emission device having a low threshold electric field (anelectric field needed for starting electron emission) while making useof its excellent electron emission characteristics when a plurality ofthe electron emission devices are arranged on a substrate so as toselectively drive them by a method such as a matrix driving (such as“line-by-line driving”). Specifically, it is an object of the presentinvention to provide an electron emission device for taking out anelectron from an electron emission material into a vacuum using aquantum tunneling phenomenon of a carrier (electron) through aninsulating layer and a tunneling phenomenon of a vacuum barrier reducedby terminating the electron emission material with hydrogen.

An electron emission device according to the present invention, as itsbasic structure, is composed of (A) a cathode electrode,. (B) aninsulating layer covering at least part of a surface of the cathodeelectrode and having a dipole layer formed on its surface, and (C) anextraction electrode (a gate electrode and/or an anode electrode).

Preferred embodiments according to the present invention will bedescribed below in detail with reference to the drawings. The scope ofthe present invention is not limited to the sizes, materials, shapes,and relative arrangements of the structural components described inthese embodiments.

The electron emission principle of the electron emission deviceaccording to the present invention will be described with reference toFIGS. 1A and 1B. In these drawings, reference numeral 1 denotes acathode electrode; numeral 2 an insulation layer; numeral 3 anextraction electrode; numeral 4 a vacuum barrier; numeral 5 an interfacebetween the insulation layer 2 having a dipole layer 20 formed thereonand a vacuum; and numeral 6 an electron.

The drive voltage for extracting (drawing) the electron 6 from thecathode electrode 1 to the vacuum is a voltage between the cathodeelectrode 1 and the extraction electrode 3 in a condition that apotential higher than a potential of the cathode electrode 1 is appliedto the extraction electrode 3.

FIG. 1A is a band diagram showing a state in which the drive voltage ofthe electron emission device according to the present invention is 0 [V](i.e., where the cathode electrode potential and extraction electrodepotential are substantially same). FIG. 1B is a band diagram showing astate where the drive voltage (>0(V]) is applied between the cathodeelectrode 1 and the extraction electrode 3. Referring to FIG. 1A, theinsulation layer 2 is being polarized by a dipole layer formed on thesurface of the insulation layer 2, so that a state, equivalent to acondition where a voltage of δ [V] is applied to the surface of theinsulation layer 2, is formed. When a voltage V (V) is applied furtherin this state, the band of the insulation layer 2 is bent more steeplywhile the vacuum barrier 4 is bent more steeply. In this state, thevacuum barrier 4 being in contact with the dipole layer is higher thanthe conduction band on the surface of the insulation layer 2 (see FIG.1B). In other words, in this state, a level (height) of the vacuumbarrier 4 being in contact with the dipole layer is higher than that ofthe conduction band on the surface of the insulation layer 2. In thisstate, the electron 6 injected from the cathode electrode 1 can beemitted into the vacuum by tunneling (quantum-mechanical tunneling)through the insulation layer 2 and the vacuum barrier 4. The drivevoltage of the electron emission device (the voltage applied between thecathode electrode 1 and the extraction electrode 3 in a drivingcondition) according to the present invention is preferably 50 V orless, and more preferably between 5 and 50 V.

The state shown in FIG. 1A will now be described with reference to FIG.2. In FIG. 2, reference numeral 20 denotes a dipole layer, numeral 21 acarbon atom, and numeral 22 a hydrogen atom. The dipole layer 20 isformed at the surface (an interface to the vacuum) of the insulationlayer 2 terminated with the hydrogen 22, in this example. However, theterminating material of the present invention is not limited to hydrogen22. Also, a carbon layer is exemplified as the insulation layer 2.Although a material of the insulation layer 2 according to the presentinvention is not limited to carbon, in view of electron emissioncharacteristics and facility in manufacturing, it is preferable to havea carbon layer as the material of the insulation layer 2. The materialfor terminating the surface of the insulation layer 2 may be any one aslong as it reduces a surface level(surface potential) of the insulationlayer 2 in a state that a voltage is not applied to between the cathodeelectrode 1 and the extraction electrode 3. But, preferably, thehydrogen is used. Also, it is preferable that, in a state where avoltage is not applied between the cathode electrode 1 and theextraction electrode 3, the material for terminating the surface of theinsulation layer 2 decreases the surface level (potential) of theinsulation layer 2 by 0.5 eV or more, and more preferably by 1 eV ormore. However, in the electron emission device according to the presentinvention, the electron affinity of the surface of the insulation layer2 is required to show positive electron affinity in both states that avoltage is applied and a voltage is not applied between the cathodeelectrode 1 and extraction electrode 3. A voltage applied to the anodeelectrode 33 is generally about over ten kV to 30 kV. Then, an electricfield intensity generated between the anode electrode and the electronemission device is generally assumed to be about 1×10⁵ V/cm or less.Therefore, it is preferable that electrons not be emitted from theelectron emission device because of the electric field intensity.Accordingly, an electron affinity on the surface of the insulation layer2 having the dipole layer 20 formed thereon may preferably be 2.5 eV ormore, considering the film thickness of the insulation layer 2 whichwill be described later.

The film thickness of the insulation layer 2 may be determined by thedrive voltage, and preferably is set at 20 nm or less, and morepreferably at 10 nm or less. The lower film thickness limit of theinsulation layer 2 may be set to any thickness as long as if enables abarrier (the insulation layer 2 and a vacuum barrier) to be formed fortunneling an electron 6 supplied from the cathode electrode 1; instead,in view of film reproduction, it is preferably set at 1 nm or more.

In this manner, in the electron emission device according to the presentinvention, the insulation layer 2 has a positive electron affinity atany state, so that a distinct on-off ratio of an electron emissionamount(i.e., a distinct difference of an electron emission amountbetween the selected state and the non-selected state) can be achieved.

FIG. 2 shows an example of the dipole layer 20 formed at the surface (aninterface to the vacuum) of the insulation layer 2 terminated with thehydrogen 22. Preferably, the hydrogen 22 is positively polarized (δ+)slightly. Thereby, atoms (carbon atoms 21, in this case) on the surfaceof the insulation layer 2 are negatively polarized (δ−) slightly to formthe dipole layer (also referred to as “an electric double layer”) 20.

Therefore, as shown in FIG. 1A, in the electron emission deviceaccording to the present invention, even though the drive voltage is notapplied between the cathode electrode 1 and the extraction electrode 3,a state equivalent to a state where a potential δ(V) of the electricdouble layer is applied is formed on the surface of the insulation layer2. Also, as shown in FIG. 1B, by the application of the drive voltageV(V) between the cathode electrode 1 and the extraction electrode 3, thelevel (potential) reduction in the surface of the insulation layer 2progresses while the vacuum barrier 4 is also lowered in conjunctiontherewith. According to the present invention, the film thickness of theinsulation layer 2 is appropriately set so that an electron canquantum-mechanically tunnel the insulation layer 2 in response to thedrive voltage V (V); for example, in view of the load of the drivecircuit, 10 nm or less is preferable. When the film thickness becomesabout 10 nm, the spatial distance of the insulation layer 2, throughwhich the electron 6 supplied from the cathode electrode 1 tunnels byapplication of the drive voltage V (V), is also reduced, resulting in apossible state of tunneling.

As described above, the vacuum barrier 4 is also lowered in conjunctionwith application of the drive voltage V(V) while the spatial distance ofthe vacuum barrier 4 is reduced in the same way as that of theinsulation layer 2, so that the vacuum barrier 4 can also be tunneledthrough, achieving the electron emission to the vacuum.

Various modifications may be made in the electron emission deviceaccording to the present invention. Such modifications are shown inFIGS. 3 to 6. In the drawings, reference numeral 31 denotes a substrateand numeral 32 a gate electrode as an extraction electrode, and likereferences designate like components common to FIGS. 1A to 2.

As shown in FIGS. 3 to 6, according to the present invention, on asurface of the substrate 31, a gate electrode 32 and the cathodeelectrode 1 are arranged so that there is an interval there between; thesurface of the cathode electrode 1 preferably is covered with theinsulation layer 2 having the dipole layer 20; and an anode electrode 33is further arranged so as to oppose the cathode electrode 1 to form aso-called triode structure.

Referring to FIGS. 3 to 6, a voltage Vg is applied between the gateelectrode 32 and the cathode electrode 1, and a voltage Va is appliedbetween the cathode electrode 1 and the anode electrode 33 and is higherthan the voltage Vg.

In the configurations shown in FIGS. 3 to 6, when the voltages Vg (V)and Va (V) are applied for driving the electron emission devices, astrong electric field is applied to the insulation layer 2 on thecathode electrode 1 and the shape of an equipotential surface isdetermined by the voltage Vg (V), the thickness and shape of theinsulation layer 2, and a dielectric constant of the insulation layer 2.The equipotential surfaces periphery (out of the interspace regionbetween the cathode electrode 1 and the gate electrode 32) of theinsulation layer 2 becomes substantially parallel to the anode electrodesurface, although in dependence on the distance between the anodeelectrode 33 and the cathode electrode 1.

When an electric field applied to the insulation layer 2 (which is anelectron emission film) exceeds a predetermined threshold value, anelectron emission takes place from the insulation layer 2. At this time,the emitted electron is accelerated toward the anode electrode 33 so asto impinge upon a fluorescent material (not shown) disposed on a lowersurface of the anode electrode 33, to cause the material to emit light.

FIG. 3 shows that the insulation layer 2 having the dipole layer 20mentioned above substantially covers the entire surface of the cathodeelectrode 1, and FIG. 4 shows that the insulation layer 2 is not incontact with the substrate 31 adjacent a side (side face) of electrodelopposing and facing the gate electrode 32, so that part of a lowerportion of the side of the cathode electrode 1 is exposed. FIG. 5 showsthat the insulation layer 2 is arranged only on a top surface (thesurface opposing the anode electrode 33 or the surface substantiallyparallel to the substrate 1) of the cathode electrode 1, and FIG. 6shows that an end of the insulation layer 2 facing electrode 32 isretracted from an end (edge) of the surface of electrode 1 opposing thegate electrode 32, so that part of an upper surface (edge surface) ofthe cathode electrode 1 is exposed. In view of the efficiency (the ratioof electrons arriving at the anode electrode 33 to the total amount ofelectrons emitted from the cathode electrode 1) of the electronemission, the states have an excellent tendency on the order of FIG. 3<FIG. 4 <FIG. 5 <FIG. 6. In the state shown in FIG. 6, since theuniformity of the electric field applied to the insulation layer 2 ishigh, the uniformity of the emission current density distribution may bemore increased.

The examples mentioned above have a triode structure; however,alternatively, in other embodiments they may have a so-called diodestructure by eliminating the gate electrode 32 from the configurationsshown in FIGS. 3 to 6. In this case, the anode electrode becomes anextraction electrode. In FIGS. 3 to 6, the gate electrode 32 and thecathode electrode 1 are arranged on the same substrate; alternatively,in other embodiments a configuration such as a so-called spinto-type mayalso be adopted in which the gate electrode 32 is arranged between thecathode electrode 1 and the anode electrode 33, and above the cathodeelectrode 1. In such a configuration, generally, an insulating layer(not shown) is disposed between the cathode electrode 1 and the gateelectrode for electrical insulation. In this case, it is preferable thatan opening, namely a so-called “gate hole”, through which an electroncan pass, be formed. The opening is preferably provided in theinsulating layer and the gate electrode so that the cathode electrode 1is exposed to the opening, and the opening of the insulating layer isarranged by corresponding (communicating) it positionally to the openingof the gate electrode.

Also, in the triode structure, by a composite electric field generatedby both the gate electrode 32 and the anode electrode 33, an electroncan be emitted from the cathode electrode 1 (the insulation layer 2). Insuch a case, the gate electrode 32 and the anode electrode 33 constitutethe extraction electrode.

The electron emission device according to the present inventiontypically can emit an electron by applying an electric field with lessthan 1×10⁶ V/cm between the surface of the insulation layer 20 and theextraction electrode. Since the insulation layer 20 is very small inthickness, the electron emission device according to the presentinvention effectively can emit an electron by applying an electric fieldwith less than 1×10⁶ V/cm between the cathode electrode and theextraction electrode.

According to the present invention, it is preferable that the cathodeelectrode 1 have a flat shape as shown in FIGS. 3 to 6; However, inorder to increase the electric field, the cathode electrode 1 in otherembodiments may have a protruding shape such as a conical shape and soon. However, since the protruding shape has a high tendency to locallyconcentrate an electric field in excess, in the case where a number ofelectron emission devices are formed in a high density on a large areaas in a display, for example, the uniformity may be adversely reduced.Therefore, the surface shape of the cathode electrode (the surface ofthe insulation layer 2) in such a case is preferably flat. Morespecifically, the surface roughness of the cathode electrode 1 and/orthe insulation layer 2 preferably is smaller than one tenth of the filmthickness of the insulation layer by a Root-Mean-Square (RMS) notationsystem. Furthermore, it is preferable that the RMS surface roughness ofthe cathode electrode 1 and/or the insulation layer 2 be 1 nm or less.The RMS is used in, for example, Japanese Industrial Standard, andexpresses the deviation between an average curve and a measured curve bya root-mean-square.

Next, an example of a manufacturing method of the electron emissiondevice according to the present invention will be described withreference to FIGS. 7A to 7E. The manufacturing method of the illustratedembodiment is an example, and the present invention, broadly construed,is not limited only to the specific details of this embodiment. Thedepositing order and the etching method depend on the types ofstructures employed, as will be additionally described in the belowEmbodiments.

[Process 1]

Any one of quartz glass, glass with reduced impurities such as Na, sodalime glass, a composite having SiO₂ deposited on a substrate, and aninsulating substrate made of ceramics, which are sufficiently washed onsurfaces in advance, is used as a substrate 31, and on the substrate 31,an electrode layer 71 is deposited.

The electrode layer 71 generally having conductivity, is formed by ageneral film-forming technique such as vacuum deposition and sputtering.The material of the electrode layer 71 may be appropriately selectedfrom one or more metals and alloys such as Be, Mg, Ti, Zr, Hf, V, Nb,Ta, Mo, W, Al, Cu, Ni, Cr, Au, Pt, and Pd. The thickness of theelectrode layer 71 is set in the several tens of nanometers (nm) toseveral hundreds of micrometers (μm), and preferably is set in the 100nm to 10 μm range.

[Process 2 ]

As shown in FIG. 7A, the insulation layer 2 is deposited on theelectrode layer 71. The insulating layer 2 is formed by a generalfilm-forming technique such as vacuum deposition, sputtering, an HFCVD(Hot Filament CVD) method, and a plasma CVD method; however, the methodis not limited to this. The thickness of the insulation layer 2 is setin the range capable of making an electron tunnel, and preferably in the4 nm to 10 nm range.

The material of the insulation layer 2 may be fundamentally any suitableinsulating material. A material with a dielectric constant as small aspossible is preferable if only the electric field concentration is takeninto consideration. The material may preferably have a resistivityranging from 1×10⁸ to 1×10¹⁴ Ωcm. The material may preferably use carbonif it is regarded as the electron emission material. As described above,the insulation layer 2 preferably has a high resistance so as tosubstantially function as an insulator. Accordingly, the insulationlayer 2 may mainly contain amorphous carbon, diamond-like carbon (DLC),nitrides of a metal, oxides of a metal, and carbides of a metal, and itis especially preferable that the layer 2 contains sp₃ hybrid orbitalstructure carbon as a principal ingredient.

[Process 3]

In order to divide the electrode layer 71 into the cathode electrode 1and the gate electrode 32 by photolithography, a photoresist 72 ispatterned (FIG. 7B).

[Process 4]

By etching, dividing of the electrode layer 71 into the cathodeelectrode 1 and the gate electrode 32 as shown in FIG. 7C is effected.Regarding the etched surfaces of the electrode layer 71 and theinsulation layer 2, a smooth and vertical inner surface or a smooth andtapered surface is desirable and preferably obtained through the etchingprocess, and an appropriate etching method, a dry or wet method, may beselected depending on the types of materials employed. The width W of anopening (depressed portion) 73 is generally and appropriately set basedon the kind and electrical resistivity of materials constituting theelectron emission device, the work function and drive voltage of thematerial of the electron emission device, and the shape of the requiredelectron emission beam. The width W between the gate electrode 32 andthe cathode electrode 1 preferably is set to a value ranging fromseveral hundred nm to 100 μm.

The surface of the substrate 31 exposed to the opening 73 between thecathode electrode 1 and the gate electrode 32 preferably is lower thanthe boundary between the electrode 1 and the substrate 31 (may bepreferably excavated), as shown in FIG. 7C. In such a manner, byconcavely shaping the surface of the substrate 1 between the cathodeelectrode 1 and the gate electrode 32 (to form concavity), theelectrical pathway distance between the cathode electrode 1 and the gateelectrode 32 is effectively increased when the electron emission deviceis driven and the leakage current between the cathode electrode 1 andthe gate electrode 32 is reduced.

[Process 5]

As shown in FIG. 7D, the photoresist 72 is then removed.

[Process 6]

Finally, the surface of the insulation layer 2 is terminated withhydrogen by heat-treated chemical modification to form the dipole layer20 (FIG. 7E). Reference numeral 74 in FIG. 7E indicates the environmentin which this occurs. The heat treatment may also be conducted byheating in an environment containing hydrogen and hydrocarbon gas. Thehydrocarbon gas preferably includes a linear hydrocarbon gas such asacetylene gas, ethylene gas, and methane gas.

In the configuration described above and shown in FIG. 7E, theinsulation layer 2 is formed to have dipole layers 20 for each layer 2portion formed over surfaces of the cathode electrode 1 and the gateelectrode 32; however, it is preferable that the portion of theinsulation layer 2 disposed only on the cathode electrode 1 have thedipole layer 20.

In the electron emission device according to the present invention, asshown in FIG. 16E and FIG. 17H, a resistance layer 161 is arrangedbetween the cathode electrode 1 and the insulation layer 2. By addingthe resistance layer 161, the temporal variation of an electric currentemitting during the electron emission can be suppressed. The detailedmanufacturing method of such a device will be described in an embodimentwhich will be described below.

The film thickness of the resistance layer 161 ranges from several tensof nanometers (nm) to several millimeters (mm); preferably, it is in arange between several tens of nanometers (nm) and several micrometers(μm). The resistance of the resistance layer 161 with a thickness withinthe above range preferably is selected from the range between 1×10⁵ Ωand 10⁸ Ω in practice, from the range between 1×10⁶ Ω and 10⁷ Ω. Thematerial of the resistance layer 161 may includes DLC (diamond likecarbon), amorphous carbon, and doped amorphous silicon; however, it isnot limited to these materials only.

Next, applications of the electron emission device according to thepresent invention will be described below. By arranging a plurality ofthe electron emission device elements (the electrodes and layer 2 withthe dipole layer) (for convenience, hereinafter referred to as “electronemission devices”), according to the present invention on a base(substrate), an electron source and an image display can be constructed,for example.

Various arrangements of the electron emission devices may be adopted. Asan example, there is a so-called matrix arrangement in that a pluralityof the electron emission devices are arranged in plural rows along theX-direction and in plural columns along the Y-direction. One of therespective cathode electrode and gate electrode of each of constitutinga plurality of the electron emission devices arranged along a samecolumn is commonly connected to a corresponding wiring in theX-direction while the other of the respective cathode electrode and gateelectrode of the electron emission device is connected to acorresponding wiring (in the Y-direction) to which plural electronemission devices in the same column also connected.

An electron source according to the present invention with a matrixarrangement obtained by arranging a plurality of the electron emissiondevices will be described with reference to FIG. 8. Referring FIG. 8,reference numeral 81 denotes an electron source base (substrate);numeral 82 denotes wirings arranged in the X-direction; and numeral 83denotes wirings arranged in the Y-direction. Reference numeral 84denotes an electron emission device; and numeral 85 denotes an opening.In the electron emission device 84 in this example, an arrangement isexemplified in that on the cathode electrode 1 having an electronemission film, the gate electrode 32 having an opening 85 is arranged.

M wirings 82 in the X-direction, composed of Dxl to Dxm, are made of ametal or the like by vacuum deposition, printing and sputtering or thelike. The material, the film thickness, and the width of the wirings areappropriately designed based on predetermined criteria. N wirings 83 inthe Y-direction, composed of Dyl to Dyn, are made in the same way. Notethat, both M and N are positive integers. Between the individual wirings82 and the individual wirings 83, an interlayer insulating layer (notshown) is provided so as to electrically insulate the wirings 82 fromthe wirings 83.

The interlayer insulating layer (not shown) is made of SiO₂ or the likeformed by vacuum deposition, printing, and sputtering or the like. Partof (i.e., an end of) the wirings 82 and the wirings 83 is used asexternal terminals.

Electrodes (i.e., the cathode electrode 1 and the gate electrode 32)constituting each electron emission device 84 are electrically connectedto a corresponding wiring 82 and a corresponding wiring 83.

The material for making the wirings 82 and the wirings 83 and thematerial for making the cathode electrode 1 and the gate electrode 32may be identical to or different from each other, in part or in theentirety of the elements constituting the materials. If they areidentical, the wirings 82 and the wirings 83 may also be called as thecathode electrode 1 or the gate electrode 32.

To the wirings 82 in the X-direction, a scanning signal applying driver(not shown) is connected for selecting a line of the electron emissiondevices 84. On the other hand, to the wirings 83 in the Y-direction, amodulation signal generating driver (not shown) is connected formodulating each row of the electron emission devices 84 corresponding toan input signal. The drive voltage applied to each electron emissiondevice is supplied as the voltage difference between the scanning signaland the modulation signal applied to the device. A configuration isexemplified here in that the scanning signal is applied to the gateelectrode 32 while the modulation signal is applied to the cathodeelectrode 1; inversely, to the gate electrode 32, the modulation signalmay be applied while to the cathode electrode 1, the scanning signal maybe applied.

In the configuration described above, individual devices are selected soas to enable them to be driven (and consequently emit electrons) usingsimplified matrix wirings. An image display using an electron sourcewith such a simplified matrix arrangement will be described withreference to FIG. 9. FIG. 9 is a schematic view showing an example of adisplay panel of the image display. Like reference numerals designatelike members in FIG. 9 common to FIG. 8.

Referring to FIG. 9, the electron source base (substrate) 81 has aplurality of the electron emission devices 84 according to the presentinvention; and is fixed to a rear plate 91; and a face plate 96 has animage forming member composed of a fluorescent screen 94 and a metalback 95 or the like formed on the internal surface of a transparentsubstrate 93 such as a glass substrate. To a support frame 92, the rearplate 91 and the face plate 96 are bonded by an adhesive such as a fritglass. Consequently, the package (panel envelope) 97 is composed of theface plate 96, the support frame 92 and the rear plate 91.

Since the rear plate 91 is provided for mainly reinforcing the strengthof the electron source base 81, in the case where the electron sourcebase 81 itself has a sufficient strength, the separate rear plate 91 maybe omitted. That is, by directly sealing the support frame 92 to theelectron source base 81, the package 97 may be constructed of the faceplate 96, the support frame 92, and the electron source base 81. On theother hand, between the face plate 96 and the rear plate 91, a support(not shown) called a spacer preferably is provided so that the package97 having a strength sufficient to the atmospheric pressure may also beconstructed.

Next, the package (envelope) 97 is sealed after the face plate 96,support frame 92 and the rear plate 91 are bonded. In the sealingprocess, while the package 97 is heated, the inside of the package 97 isexhausted through an exhaust pipe (not shown) by a vacuum pump, then,the exhaust pipe is sealed off. In order to maintain the pressure of thepackage 97 after the face plate 96, support frame 92 and the rear plate91 are bonded, a getter treatment may also be carried out. The getter(not shown) may use an evaporation type such as Ba (barium) and/or anon-evaporation type of getter. Also, a method is exemplified here inthat the exhaust pipe is sealed after the face plate 96, support frame92 and the rear plate 91 are bonded; alternatively, if the bonding isperformed in a vacuum chamber, the sealing of the exhaust pipe is notnecessarily required, so that the exhaust pipe itself is not necessary.

In the image display constructed using the electron source with a matrixarrangement produced by the above processes, by applying a voltage toeach electron emission device via the external terminals Dxl to Dxm andDyl to Dyn outside the package, an electron can be emitted from adesired electron emission device. Also, by applying a high voltage Va tothe metal back 95 or a transparent electrode (not shown) via ahigh-voltage terminal 98, an electron beam is accelerated. Theaccelerated electron impinges upon the fluorescent screen 94 so as tocause screen 94 to emit light and form an image.

The image display according to the present invention may also be used inan image display for an optical printer constructed using aphotosensitive drum in addition to image displays for televisionbroadcasting, a television meeting system, and a computer and the like.

Also according to the present invention, a data displaying and/orplaying apparatus using the package 97 can be constituted. Specifically,the data displaying and/or playing apparatus includes at least thepackage 97, a receiver for receiving a broadcasting signal such as atelevision broadcasting signal, and a tuner for tuning on a station fromreceived signals. Then, at least one of image information, alphabeticinformation, and speech information contained in the tuned signals isproduced to the package 97 so as to display and/or reproduce it. Becauseof this configuration, the data displaying and/or playing apparatusfulfils the function of a television.

In the case where a broadcasting signal is encoded, the data displayingand/or playing apparatus can also include a decoder of course. Thespeech signal is produced to sound-reproducing means such as a speakerhoused in the data displaying and/or playing apparatus so as toreproduce it simultaneously with the image information and thealphabetic information displayed on the package 97.

A method for displaying and/or reproducing the image information or thealphabetic information by outputting it to the package 97 may be asfollows:

First, an image signal corresponding to each pixel of the package 97 isproduced from the received image information or alphabetic information.Then, the produced image signal is entered to a drive circuit of thepackage 97. On the basis of the image signal entered in the drivecircuit, the image is displayed by controlling a voltage to be appliedto an electron emission element within the package 97 from the drivecircuit.

EXAMPLES

Examples of the present invention will be described in detail below.

Example 1

According to the manufacturing method shown in FIG. 10, a semiconductorlayer (an electron-emission layer) having a dipole layer according tothe present invention was manufactured. References in FIG. 10areidentical to those in FIG. 7.

Using quartz as the substrate 31, a TiN film with a thickness of 500 nmwas formed by sputtering as the cathode electrode 1 after the substrate31 was sufficiently washed (FIG. 10A). The film forming conditions areas follows:

-   Rf power supply: 13.56 MHz-   Rf power: 7.7 W/cm²-   gas pressure: 0.6 Pa-   atmosphere gas: N₂/Ar (N₂: 10%)-   substrate temperature: room temperature-   target: Ti

Then, a carbon film was deposited with a thickness of. 4 nm on thecathode electrode 1 by sputtering so as to form the insulation layer 2(FIG. 10B). Using a graphite target as the target, the film was formedin an argon atmosphere.

Next, the above-mentioned insulation layer 2 was heat-treated in a mixedgas atmosphere of methane and hydrogen so as to form the dipole layer 20at the surface of the insulation layer 2 (FIG. 10C). The heat treatmentconditions are as follows:

-   heat treatment temperature: 600° C.-   heating system: lamp heating-   treatment time: 60 min-   gas mixture ratio: methane/hydrogen=15/6-   pressure during heating: 6.65 KPa

A secondary electron energy spectrum (abbreviated as “SES” below) of theinsulation layer 2 (electron emission film) having the dipole layer 20obtained by the above manufacturing method is schematically shown inFIG. 11A.

The SES is obtained by irradiating a sample with an electron beam so asto measure the energy distribution of a secondary electron emitted inresponse thereto, and a work function of the sample can be estimatedfrom the intercept of the SES.

FIG. 1B schematically shows the SES of a diamond-like like carbon (DLC)film as the reference. Character A of FIG. 1B indicates the SES of theDLC film, and character B the SES measured in a state that a biasvoltage of 2 V is applied to the DLC film. As shown in FIG. 11B, it isunderstood that when a potential is applied on the surface of the DLCfilm, an apparent work function is reduced by the applied potential.

In the electron emission device according to the present invention, theband is bent by the dipole layer 20 formed at the surface (or on thesurface) of the insulation layer 2 so as to facilitate an electron to beemitted. If such a phenomenon is acted in practice, a measured result ofthe sample SES is to be obtained as if a potential might be applied onthe surface, as shown in FIG. 11B.

Character D of FIG. 11A indicates the SES of the insulation layer 2having the dipole layer 20 produced in this example, and character C theSES of the insulation layer 2 without the dipole layer 20 in that onlythe heat-treatment was not performed. In FIG. 11A, the work functionestimated from the SES is reduced by about 2 eV in the heat-treatment.If the result is examined in combination with the result from FIG. 11B,as described will respect to FIG. 2, it is understood that by theheat-treatment, the surface of the insulation layer 2 is chemicallymodified with hydrogen to form the dipole layer 20, so that the workfunction is reduced.

Next, the electron emission characteristics of the insulation layer 2produced in this Example were measured. The anode electrode (1 mm² area)was arranged so as to oppose the insulation layer 2 produced in theExample and to be separated therefrom, and a drive voltage was appliedbetween the anode electrode and the cathode electrode. Voltage/currentcharacteristics at this time are shown in FIG. 12, wherein the abscissaindicates the electric field intensity and the ordinate the emissioncurrent density. In FIG. 12, character A indicates the voltage/currentcharacteristics of the insulation layer having the dipole layer 20produced in this example, and character B indicates the voltage/currentcharacteristics of the insulation layer 2 without the dipole layer 20 inthat the heat-treatment was not performed in an atmosphere of methaneand hydrogen.

The insulation layer 2 having the dipole layer 20 of the Example has adistinct threshold electric field, and it was confirmed that an electronwas emitted with a low electric field intensity, showing excellentelectron emission characteristics.

Example 2

According to the manufacturing method shown in FIG. 10, an insulationlayer 2 having a dipole layer 20 according to the present-invention wasmanufactured.

Using quartz as the substrate 31, a W film with a thickness of 500 nmwas formed by sputtering as the cathode electrode 1 after the substrate31 was sufficiently washed (FIG. 10A).

Then, SiO₂ was deposited with a thickness of about 4 nm on the cathodeelectrode 1 by sputtering so as to form the insulation layer 2 (FIG.10B). Mixed gas of Ar/O₂=1/1 was used for an atmosphere gas. Theconditions are as follows:

-   Rf power supply: 13.56 MHz-   Rf power: 110 W/cm²-   gas pressure: 0.5 Pa-   substrate temperature: 300° C.-   target: SiO₂

Next, the substrate was heat-treated in a mixed gas atmosphere ofmethane and hydrogen so as to form the dipole layer 20 on the surface(or at the surface) of the insulation layer 2 (FIG. 10C). The heattreatment conditions are as follows:

-   heat treatment temperature: 600° C.-   heating system: lamp heating t-   treatment time: 60 min-   gas mixture ratio: methane/hydrogen=15/6-   pressure during heating: 7 KPa

The electron emission characteristics of the insulation layer 2 havingthe dipole layer 20 produced in such a manner were measured. The anodeelectrode was arranged so as to oppose the insulation layer 2 having thedipole layer 20 and to be separated therefrom, and a drive voltage wasapplied between the anode electrode and the cathode electrode. As aresult, in the same way as in Example 1, excellent electron emissioncharacteristics having a distinct threshold value and emitting electronswith a low electric field intensity were obtained.

Example 3

According to the manufacturing method shown in FIG. 7, an electronemission device of the invention was manufactured.

(Process 1)

Using quartz as the substrate 31, a TiN film with a thickness of 500 nmwas formed by sputtering as the electrode layer 71 after the substrate31 was sufficiently washed.

(Process 2)

Then, a carbon film was deposited with a thickness of about 6 nm by ECRplasma CVD (electron cyclotron resonance plasma chemical vapordeposition) so as to form a semiconductor layer 2 (FIG. 7A). This wastinder conditions that the DLC (diamond-like carbon) grows. The growingconditions are as follows:

-   gas: CH₄-   microwave power: 400 W-   substrate bias: −90 V-   gas pressure: 25 mm Pa-   substrate temperature: room temperature    (Process 3)

Next, as shown in FIG. 7B, a positive-type photoresist (AZ®1500 made byClariant Co.) was spin-coated, exposed, and developed byphotolithography so as to form a mask pattern (the photoresist 72).

(Process 4)

As shown in FIG. 7C, the DLC film and the TiN electrode werecontinuously dry-etched using the mask pattern as a mask. In order toreduce the leakage due to carbon slightly produced during theheat-treating of the gate electrode and the cathode electrode, theetching was performed slightly excessively to a degree of slightlyetching the quartz.

(Process 5)

As shown in FIG. 7D, the mask pattern was completely removed.

(Process 6)

Finally, as shown in FIG. 7E, the substrate was heat-treated in a mixedgas atmosphere of methane and hydrogen so as to form the dipole layer 20on the surface (or at the surface) of the insulation layer 2 and tocomplete the electron emission device. The heat treatment conditions areas follows:

-   heat treatment temperature: 600° C.-   heating system: lamp heating-   treatment time: 60 min-   gas mixture ratio: methane/hydrogen=15/6-   pressure during heating: 6 KPa

Above the electron emission device manufactured as described above, asshown in FIG. 3, the anode electrode 33 was arranged, and voltages wereapplied between the cathode electrode 1 and the gate electrode 32 andacross the anode electrode 33 so as to drive them. FIG. 13 is a graph ofthe voltage/current characteristics of the electron emission device. Theelectron emission device in the Example could emit electrons with a lowvoltage and have a distinct threshold value. The drive voltages inpractice were a voltage Vg (voltage applied between the cathodeelectrode 1 and the gate electrode 32)=20 V and a voltage Va (voltageapplied between the cathode electrode 1 and the anode electrode 33)=10kV.

Example 4

An image display was manufactured using the electron emission devicemanufactured in the Example 3.

The electron emission devices manufactured in Example 3 were arranged ina matrix pattern of 100×100 so as to configure the electron source. Asshown in FIG. 8, the wirings 82 in the X-direction were connected to thecathode electrode 1 while the wirings 83 in the Y-direction wereconnected to the gate electrode 32. In addition, FIG. 8 schematicallyshows that in the electron emission device 84, the gate electrode 32having the opening 85 formed on the cathode electrode 1 is arranged;however, the electron emission device of the image display of theExample does not completely correspond to it. The structure of thisExample is identical to the structure schematically shown in FIG. 8except for the structure of the electron emission device (structureshown in Example 3). The electron emission devices in this Example werearranged at pitches of 300 μm by 300 μm. Above each electron emissiondevice, any one of fluorescent materials emitting each of red, blue, andgreen light was arranged.

By “line-by-line driving” of the electron sources so as to displayimages, a high-brightness and high-fineness image display was obtainedwith excellent contrast.

Example 5

(Process 1)

First, as shown in FIG. 16A, using quartz as the substrate 31, aftersufficiently washing it, TiN with a thickness of 500 nm was produced asthe electrode layer 71 by sputtering.

(Process 2)

Then, carbon with a thickness of 50 nm was produced as the insulationlayer 161 by sputtering. The carbon was modulated so as to have aresistance of 1×10⁶ Ω. target: graphite

-   gas: Ar-   r. f. power: 500 W-   gas partial pressure: 0.27 Pa    (Process 3)

Next, carbon was deposited to have a carbon film with a thickness ofabout 6 nm as the insulation layer 2 by the ECR plasma CVD method. Thefilm was formed under the condition that DLC grows at this time. Thegrowing conditions are shown as follows:

-   gas: CH₄-   microwave power: 400 W-   substrate bias: −90 V-   gas pressure: 25 mmPa-   substrate temperature: room temperature    (Process 4)

Then, as shown in FIG. 16B, by photolithography, a positive-typephotoresist (AZ1500/made by Clariant Co.) was spin-coated, exposed, anddeveloped by photolithography so as to form a mask pattern (the resist72).

(Process 5)

As shown in FIG. 16C, using the mask pattern as a mask, the insulationlayer 2, the resistance layer 161, and the electrode layer 71 weresequentially dry-etched, with layer 71 then forming elements 1 and 32.The etching was performed slightly excessively to a degree of slightlyetching the quartz. In the example, the width of the opening 73 was setat 2 μm.

(Process 6)

As shown in FIG. 16D, the mask pattern was completely eliminated. Thefilm stress was small and process problems such as film peeling did notarise.

(Process 7)

Finally, as shown in FIG. 16E, in a hydrogen atmosphere (99.9%hydrogen), the substrate was heat-treated at 630° C. for 60 min by alamp so as to complete the electron emission device of the Example.

The anode electrode was arranged above the electron emission deviceproduced as above, and the device was driven in the same way as in theExample 3. As a result, in the electron emission device of this Example,the temporal variation of an electric current emitting during theelectron emission was alleviated in comparison with the electronemission device of the Example 3.

Example 6

(Process 1)

First, as shown in FIG. 17A, using quartz as the substrate 31, aftersufficiently washing it, TiN with a thickness of 500 nm was produced asthe electrode layer 71 by sputtering.

(Process 2)

Then, as shown in FIG. 17B, by the photolithography, a positive-typephotoresist (AZ1500/made by Clariant Co.) was spin-coated, exposed, anddeveloped by photolithography so as to form a mask pattern (the resist72).

(Process 3)

As shown in FIG. 17C, using the mask pattern as a mask, the electrodelayer 71 was dry-etched. The etching was performed slightly excessivelyto a degree of slightly etching the quartz.

(Process 4)

Next, carbon was formed to have a carbon film with a thickness of 50 nmas the resistance layer 161 by sputtering. The carbon at this time wasmodulated so as to have a resistance of 1×10⁷ Ω.

-   target: graphite-   gas: Ar-   r. f. power: 500 W-   gas partial pressure: 0.27 Pa    (Process 5)

Next, carbon was deposited to have a carbon film with a thickness ofabout 6 nm as the insulation layer 2 by the ECR plasma CVD method. Thefilm was formed under the condition that DLC grows at this time. Thegrowing conditions are shown as follows:

-   gas: CH₄-   microwave power: 400 W-   substrate bias: −90 V-   gas pressure: 25 mmPa-   substrate temperature: room temperature    (Process 6)

Then, as shown in FIG. 17F, by photolithography, a positive-typephotoresist (AZ1500/made by Clariant Co.) was spin-coated, exposed, anddeveloped by photolithography so as to form a mask pattern (resist 72).

(Process 7)

As shown in FIG. 17G, using the mask pattern as a mask, the insulationlayer 2 and the resistance layer 161 were sequentially dry-etched, andthen, the mask pattern was completely eliminated. In the example, thewidth of the opening 73 was set at about 1 μm. The film stress was smalland process problems such as film peeling did not arise.

(Process 8)

Finally, as shown in FIG. 17H, in a hydrogen atmosphere (99.9%hydrogen), the substrate was heat-treated at 630° C. for 60 min by alamp so as to complete the electron emission device of the Example.

The anode electrode was arranged above the electron emission deviceproduced as above, and the device was driven in the same way as in theExample 3. As a result, in the electron emission device of this Example,the temporal variation of an electric current emitting during theelectron emission was alleviated in comparison with the electronemission device of the Example 5.

Example 7

In this Example, electron sources were manufactured by arranging anumber of electron emission devices respectively produced in Example 5and Example 6, and image displays using the respective electron sourceswere manufactured.

In the respective electron sources, each electron source wasmanufactured in the same way as in. Example 4 other than the structureof each electron emission device. Then, when images were displayed byline-sequentially driving the electron source, high-brightness and fineimages excellent in contrast could be stably displayed for a longperiod.

While the present invention has been described with reference to whatare presently considered to be the preferred embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments. To the contrary, the invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims. The scope of the following claims is to beaccorded the broadest interpretation so as to encompass all suchmodifications and equivalent structures and functions.

1. An electron-emitting device comprising: a cathode electrode; aninsulation layer covering at least part of a surface of the cathodeelectrode and having a dipole layer formed on its surface; and anextraction electrode, wherein an electron emission to vacuum, byquantum-mechanical tunneling through the insulation layer and a vacuumbarrier by applying a voltage between the cathode electrode and theextraction electrode, takes place in a condition that the vacuum barrierin contact with the dipole layer is higher than a conduction band on thesurface of the insulation layer. 2.-4. (canceled)
 5. Anelectron-emitting device according to claim 1, wherein the insulationlayer contains carbon as a principal ingredient. 6.-15. (canceled) 16.An electron source comprising a plurality of electron emission devices,each of the plurality of electron-emitting devices is constituted by theelectro-emitting device according to claim
 1. 17. An image displaycomprising an electron source according to claim 16 and a luminous body.18. A data displaying and/or playing apparatus comprising an imagedisplay, a receiver for receiving an information signal, a tuner and adriver for driving the image display, wherein the image display isconstituted by the image display according to claim 17.